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Shenzhen Xinyongsheng Electronics Co., Ltd.
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PCB Process 20: Packaging Procedure
Time: 2018-11-28 Read: 3372

First, the process flow chart:


Upper process → 焗 board → sub-board → vacuum packaging (anti-static packaging) → cutting → lower process


Second, the equipment and its role:


1. Vacuum packaging machine for the packaging of circuit boards, generally 10 pieces/package, especially subject to customer's requirements;


2. Furnace, used for special customer requirements of the circuit board to dry moisture;


Third, the environmental requirements:


1. Temperature and humidity requirements: temperature: 20±5°C; relative humidity: ≤75%


2. Environmental protection requirements: All kinds of wastes generated in the packaging process, such as: waste foam, paper skin, waste paperboard, tape, etc., cannot be randomly placed, and should be put away at the designated location by the cleaners.


Fourth, the safety rules:


1. Do not touch all kinds of plugs and sockets, if there are any abnormalities, immediately notify SE to process;


2. One person, one machine operation;


3. When the machine is running, do not touch any heating wire. If there is any abnormality, immediately press the emergency stop button to prevent accidents;


4. The power supply should be turned off before the raft is opened, and the circuit board can be transported after cooling.

Address: 3rd Floor, Building D, Zehao Industrial Park, Zhenmei Village, Guangming Town, Baoan District, Shenzhen
Tel:0755-33840599      0755-33840592
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