With the rapid development of mobile phones, computers, and electronic digital industries, the pcb circuit board industry is constantly meeting the needs of the market and consumers, and has promoted the continuous increase in the output value of the industry. However, the competition in the pcb circuit board industry is intensifying, and many pcb manufacturers are willing to do so. Lower prices and exaggerate production capacity to attract a large number of customers. However, low-priced pcb boards must use cheap materials, affect product quality, short service life, and the product is prone to surface damage, bumps and other quality problems.
The purpose of pcb circuit board proofing is to determine the strength of the manufacturer, which can effectively reduce the non-performing rate of pcb circuit board, and also lay a solid foundation for future mass production. The following is based on the Shenzhen Lianxinghua PCB circuit board proofing process. Let me explain.
Pcb board proofing
PCB circuit board proofing process:
First, contact the manufacturer
First of all, you need to tell the manufacturer the documents, process requirements, and quantity. What parameters do you need to provide for the pcb circuit board proofing? You can click here to get the information and provide good information. Then there will be a professional quote for you, order, and Follow up the production schedule.
Second, the material
Purpose: According to the requirements of the engineering data MI, cut into small pieces of plate on the large sheet that meets the requirements, and meet the small sheet of the customer's requirements.
Process: large sheet material → cutting board according to MI requirements → seesaw → beer fillet \ edging → exit board
Third, drilling
Purpose: According to the engineering data, the required hole diameter is drilled at the corresponding position on the sheet of the required size.
Process: stacking pin → upper plate → drilling → lower plate → inspection \ repair
Fourth, sinking copper
Purpose: Copper is deposited by chemically depositing a thin layer of copper on the walls of the insulating holes.
Process: coarse grinding → hanging plate → copper-plated automatic line → lower plate → dip 1% diluted H2SO4 → thick copper
Five, graphics transfer
Purpose: Graphic transfer is the transfer of images on the production film to the board.
Process: (blue oil process): grinding board → printing the first side → drying → printing the second side → drying → explosion → shadowing → inspection; (dry film process): hemp board → laminating → standing → right Bit → Exposure → Rest → Shadow → Check
Sixth, graphic plating
Purpose: Graphic plating is performed on a bare copper skin of a line pattern, or a layer of copper having a desired thickness and a thickness of gold nickel or tin is electroplated on the wall of the hole.
Process: upper plate → degreasing → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate
Seven, unwinding
Purpose: Retreat the anti-plating coating layer with NaOH solution to expose the non-line copper layer.
Process: water film: inserting → soaking alkali → washing → scrubbing → passing machine; dry film: placing board → passing machine
Eight, etching
Purpose: Etching is the use of chemical reaction to corrode the copper layer in non-line parts.
Nine, green oil
Purpose: Green oil transfers the pattern of green oil film to the board to protect the line and prevent tin on the line when soldering parts.
Process: grinding plate → printing photosensitive green oil → 锔 plate → exposure → shadow; grinding plate → printing the first side → baking sheet → printing the second side → baking sheet
Ten, characters
Purpose: Characters are an easy-to-recognize mark.
Process: After the end of green oil → cool and cool → adjust the network → print characters → after 锔
Eleven, gold-plated fingers
1. Purpose: Plating a layer of nickel/gold with a required thickness on the plug finger to make it more rigid and wear resistant.
Process: upper plate → degreasing → water washing twice → micro-etching → water washing twice → pickling → copper plating → water washing → nickel plating → water washing → gold plating
2, tin plate (a process of juxtaposition)
Purpose: Spray tin is sprayed with a layer of lead tin on the bare copper surface not covered with the solder resist oil to protect the copper surface from oxidation and oxidation to ensure good solderability.
Process: micro-etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and drying
Twelve, molding
Purpose: Through the die stamping or CNC machine to cut out the shape forming method required by customers, organic enamel, beer board, handcuffs, hand cut.
Note: The accuracy of the data board and the beer board is higher, and the handcuffs are second. The hand cutting board can only make some simple shapes.
Thirteen, testing
Purpose: Through the electronic 100% test, it can detect the open circuit, short circuit and other defects that are not easily found by visual observation.
Process: upper mold → release board → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap
Fourteen, final inspection
Purpose: Through 100% visual inspection of the appearance defects of the board and repair of minor defects to avoid problems and defective board outflow.
Specific work flow: incoming materials → view data → visual inspection → qualified → FQA random inspection → qualified → packaging → unqualified → processing → check OK!
Due to the high technical content of the design, processing and manufacturing of pcb circuit boards. Therefore, only precise and strict every detail of pcb proofing and production can have high quality pcb board products. Win the favor of more customers and win a bigger market.
